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SK hynix Semiconductor Curriculum, 5th cohort
Selected for the self-nomination track of SK hynix's semiconductor education programme, covering memory devices, fabrication, packaging, reliability and metrology.
- Period
- Sep 2026 – Present
- Role
- Self-nomination track
- Status
- In progress
- Result
- Selected for the self-nomination track of SK hynix's semiconductor education programme, covering memory devices, fabrication, packaging, reliability and metrology.
I was selected for the self-nomination track of SK hynix’s semiconductor education programme. It is taught from the point of view of people who build memory for a living, which is a different angle from university lectures: less derivation, more of what actually limits a product.
What the curriculum covers:
- Memory devices. How DRAM and NAND cells work and what sets their characteristics, DRAM process integration, and 3D NAND.
- Fabrication. Etch, diffusion and thin-film processes, and where each sits in the manufacturing flow.
- Solutions and image sensors. System-on-chip basics, the structure and operation of CMOS image sensors, and what the image signal processor does.
- Packaging. Front-end and back-end packaging, chiplets and advanced packaging.
- Quality, reliability and test. Quality through product development and production, reliability testing, DRAM test and failure mechanisms, and the basics of NAND test.
- Metrology and inspection. Measurement and inspection methods, including image-based measurement.
It lines up closely with what I am doing elsewhere. The NAND and DRAM sessions give context to my TCAD work, and the process sessions explain decisions I only saw from the outside in the cleanroom.